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1 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 general description the az75232 combines thr ee drivers and five receiv- ers, which conform to the eia/tia-232-f and itu v.28 standards. each receiver converts eia/tia-232-f inputs to 5-v ttl/cmos levels and each driver con- verts ttl/cmos input levels into eia/tia-232-f levels. the flow-through pinout facilitates simple non-cross- over board layout. the az75232 provides a one-chip solution for the common 9-pin serial rs-232 interface between data terminal and data communications equip- ment. the az75232 is available in soic-20, ssop-20 and tssop-20 packages. features single chip with easy interface between uart and serial-port connector meet the requirement of eia/tia-232-f and itu v.28 standards designed to support data rates up to 120kbit/s 3 drivers and 5 receivers flow-through pinout applications mother board peripheral equipment figure 1. package types of az75232 ssop-20 soic-20 tssop-20
2 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 figure 2. pin configuration of az75232 (top view) pin description pin number pin name function pin number pin name function 1 v dd positive supply voltage for driver 11 gnd ground 2 ra1 receiver input 12 ry5 receiver output 3 ra2 receiver input 13 da3 driver input 4 ra3 receiver input 14 ry4 receiver output 5 dy1 driver output 15 da2 driver input 6 dy2 driver output 16 da1 driver input 7 ra4 receiver input 17 ry3 receiver output 8 dy3 driver output 18 ry2 receiver output 9 ra5 receiver input 19 ry1 receiver output 10 v ss negative supply voltage for driver 20 v cc supply voltage for receiver m/gs/g package (soic-20/ssop- 20/tssop-20) pin configuration 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 v dd ra1 ra2 ra3 dy3 ra4 dy2 dy1 ra5 v ss v cc ry5 da3 ry4 da2 da1 ry3 ry2 ry1 gnd
3 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 functional block diagram figure 3. functional block diagram of az75232 package tempe rat ure range part number marking id packing type lead free green lead free green soic-20 -40 to 85 o c az75232m-e1 AZ75232M-G1 az75232m-e1 AZ75232M-G1 tube az75232mtr-e1 az75232mtr-g1 az75232m-e1 AZ75232M-G1 tape & reel ssop-20 -40 to 85 o c az75232gs-e1 az75232gs-g1 az75232gs-e1 az75232gs-g1 tube az75232gstr-e1 az75232gstr-g1 az75232gs-e1 az75232gs-g1 tape & reel tssop-20 -40 to 85 o c az75232g-e1 az75232g-g1 232ge 232gg tube az75232gtr-e1 az75232gtr-g1 232ge 232gg tape & reel circuit type package m: soic-20 e1: lead free g1: green az75232 - ordering information tr: tape and reel blank: tube 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 v ss v cc gnd v dd ra1 ra2 ra3 dy3 ra4 dy2 dy1 ry5 da3 ry4 da2 da1 ry3 ry2 ry1 ra5 gs: ssop-20 g: tssop-20 bcd semiconductor's pb-free products, as designa ted with "e1" suffix in the part num ber, are rohs compliant. products with "g1" suffix are available in green packages.
4 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 parameter symbol value unit supply voltage v dd 15 v v ss -15 v cc 7 input voltage range v i driver -15 to 7 v receiver -30 to 30 power dissipation (t a =25 o c) p d soic-20 1340 mw ssop-20 1210 tssop-20 1100 driver output voltage range v o -15 to 15 v receiver low-level output current i ol 20 ma operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanen t damage to the device. these are stress ratings only, and functi onal operation of the device at these or any other conditions be yond those indicated under "recommended operating co nditions" is not implied. exposure to "abs olute maximum ratings " for extended periods may affect device reliability. parameter symbol min max unit supply voltage v dd 7.5 15 v v ss -15 -7.5 v cc 4.5 5.5 high-level input voltage (driver only) v ih 1.9 v low-level input voltage (driver only) v il 0.8 v high-level output current driver i oh -6 ma receiver -0.5 low-level output current driver i ol 6 ma receiver 16 operating temperature range t a -40 85 o c recommended oper ating conditions absolute maximum ratings (note 1)
5 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 parameter symbol conditions min typ max unit voltage supply section (v cc =5v, v dd =9v, v ss =-9v, unless otherwise specified) supply current from v dd i dd all inputs at 1.9v, no load v dd =9v, v ss =-9v 15 ma v dd =12v, v ss =-12v 19 v dd =15v, v ss =-15v 25 all inputs at 0.8v, no load v dd =9v, v ss =-9v 4.5 v dd =12v, v ss =-12v 5.5 v dd =15v, v ss =-15v 9 supply current from v ss i ss all inputs at 1.9v, no load v dd =9v, v ss =-9v -15 ma v dd =12v, v ss =-12v -19 v dd =15v, v ss =-15v -25 all inputs at 0.8v, no load v dd =9v, v ss =-9v -3.2 v dd =12v, v ss =-12v -3.2 v dd =15v, v ss =-15v -3.2 supply current from v cc i cc all inputs at 5v, no load, v cc =5v 30 ma driver section (v cc =5v, v dd =9v, v ss =-9v, unless otherwise specified) high-level output voltage v oh v il =0.8v, r l =3k ? 67.5 v low-level output voltage v ol v ih =1.9v, r l =3k ? -7.5 -6 v high-level input current i ih v i =5v 10 a low-level input current i il v i =0v -1.6 ma high-level short-circuit output current i os(h) v il =0.8v, v o =0v -4.5 -12 -19.5 ma low-level short-circuit out- put current i os(l) v ih =2v, v o =0v 4.5 12 19.5 ma output resistance r o v cc =v dd =v ss =0, v o =-2vto 2v 300 ? driver section (v cc =5v, v dd =12v, v ss =-12v, unless otherwise specified) propagation delay time low to high level output t plh r l =3k ? to 7k ? , c l =15pf 315 500 ns propagation delay time high to low level output t phl r l =3k ? to 7k ? , c l =15pf 75 175 ns transition time low to high level output t tlh r l =3k ? to 7k ? c l =15pf 60 100 ns c l =2500pf (note 2) 1.7 2.5 s transition time high to low level output t thl r l =3k ? to 7k ? c l =15pf 40 75 ns c l =2500pf (note 2) 1.5 2.5 s electrical characteristics (t a =25 o c, unless otherwise specified.)
6 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 parameter symbol conditions min typ max unit receiver section (v cc =5v, v dd =9v, v ss =-9v, unless otherwise specified) positive-going input thresh- old voltage v it+ 1.75 1.9 2.3 v t a = -40 to 85 o c 1.55 2.3 v negative-going input threshold voltage v it- 0.75 0.97 1.25 v input hysteresis voltage v hys 0.5 v high-level output voltage v oh i oh =-0.5ma v ih =0.75v 2.6 4 5 v input open 2.6 low-level output voltage v ol i ol =10ma , v i =3v 0.2 0.45 v high-level input current i ih v i =25v 3.6 8.3 ma v i =3v 0.43 low-level input current i il v i =-25v -3.6 -8.3 ma v i =-3v -0.43 short-circuit output current i os v i =0.8v -3.4 -12 ma receiver section (v cc =5v, v dd =12v, v ss =-12v, unless otherwise specified) propagation delay time low to high level output t plh r l =5k ? , c l =50pf 105 250 ns r l =1.5k ? , c l =15pf 100 160 propagation delay time high to low level output t phl r l =5k ? , c l =50pf 60 150 ns r l =1.5k ? , c l =15pf 42 100 transition time low to high level output t tlh r l =5k ? , c l =50pf 170 350 ns r l =1.5k ? , c l =15pf 90 175 transition time high to low level output t thl r l =5k ? , c l =50pf 16 60 ns r l =1.5k ? , c l =15pf 15 50 electrical characteristics (continued) note 2: measured between - 3v and 3v points of the output waveform (eia/tia-232-f conditions); all unused inputs are tied either high or low. (t a =25 o c, unless otherwise specified.)
7 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 figure 6. short-circuit out put current vs. temperature figure 7. slew rate vs. load capacitance typical performance characteristics figure 4. voltage transfer characteristics figure 5. output current vs. output voltage 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -12 -9 -6 -3 0 3 6 9 12 r l =3k t a =25 o c v dd =6v, v ss =-6v v dd =9v, v ss =-9v output voltage (v) input voltage (v) v dd =12v, v ss =-12v -16 -12 -8 -4 0 4 8 12 16 -20 -16 -12 -8 -4 0 4 8 12 16 20 v oh (v i =0.8v) v ol (v i =1.9v) v dd =9v v ss =-9v t a =25 o c output current (ma) output voltage (v) -40 -20 0 20 40 60 80 -12 -9 -6 -3 0 3 6 9 12 15 18 i os(h) (v i =0.8v) i os(l) (v i =1.9v) v dd =9v v ss =-9v v o =0 short-circuit output current (ma) temperature ( o c) 10 100 1000 10000 1 10 100 1000 slew rate of fall edge slew rate of rise edge v dd = 9v v ss = -9v r l = 3k t a = 25 o c slew rate (v/ s) load capacitance (pf) driver section
8 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 figure 8. input threshold voltage vs. temperature figure 9. input threshold voltage vs. supply voltage figure 10. noise rejection typical performance ch aracteristics (continued) -40 -20 0 20 40 60 80 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 v it- v it+ input threshold voltage (v) temperature ( o c) 2345678 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 v it- v it+ input threshold voltage (v) supply voltage (v) 10 100 1000 10000 0 1 2 3 4 5 6 c l =12pf c l =500pf v cc = 5v t a = 25 o c amplitude (v) pulse duration (ns) receiver section
9 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 typical application figure 11. typical application of az75232 1 5 6 9 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 v ss ra5 dy3 ra4 dy2 dy1 ra3 ra2 ra1 v dd v cc ry5 da3 ry4 da2 da1 ry3 ry2 ry1 gnd az75232 12v c1 c2 c3 -12v dcd dsr rx rts tx cts dtr ri eia/tia-232-f db9s connector ttl/cmos level 1 5v uart or serial c ri dtr cts tx rts rx dsr dcd signal ground
10 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 mechanical dimensions unit: mm(inch) soic-20 note: eject hole, oriented hole and mold mark is optional.
11 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 mechanical dimens ions (continued) unit: mm(inch) ssop-20 1.700(0.067) 1.900(0.075) optional construction 5.100(0.201) 5.500(0.217) 7.600(0.299) 8.000(0.315) 7.000(0.276) 7.400(0.291) 0.650(0.026) 0.070(0.003) 0.230(0.009) 1.400(0.055) 1.600(0.063) 0.220(0.009) 0.380(0.015) 1.690(0.067) max detail 0.090(0.004) 0.250(0.010) 1 0 7 0 see detail a 10 0 14 0 1 0 7 0 r0.150(0.006) 0.324(0.013) r0.150(0.006) 0.630(0.025) 0.950(0.037) 1.250(0.049) detail a 1.200(0.047) 1.200(0.047) dep 0.020(0.001) 0.080(0.003) [ 1.200(0.047) note: eject hole, oriented hole and mold mark is optional 0.250(0.010) ?
12 oct. 2009 rev. 1. 7 bcd semiconductor manufacturing limited data sheet multiple rs-232 drivers and receivers az75232 mechanical dimensions unit: mm(inch) tssop-20 0.650(0.026)typ 6.200(0.244) 6.600(0.260) #1 pin 6.400(0.252) 6.600(0.260) 4.300(0.169) 4.500(0.177) index 0.750(0.030) 0.850(0.033) 1.450(0.057) 1.550(0.061) 0.100(0.004) 0.190(0.007) dp 0.000(0.000) 0.100(0.004) btm e-mark dp 0.000(0.000) 0.100(0.004) 10 14 0.250(0.010)typ 0.450(0.018) 0.750(0.030) 1.000(0.039) ref 0 8 r0.090(0.004)min r0.090(0.004)min top & bottom 4- 0.200(0.008)min 0.200(0.008) 0.280(0.011) 0.050(0.002) 0.150(0.006) 0.800(0.031) 1.050(0.041) 1.200(0.047) max 0.340(0.013) 0.540(0.021) note: eject hole, oriented hole and mold mark is optional.
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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